Product Name Samsung DDR2 SDRAM 2GB 2R×8 PC2-6400 Part Number M378T5663QZ3-CF7 Manufacturer Samsung Electronics Country of Manufacture China Build Year/Week 2009/04, 2010/07 Memory Module Type DIMM Data Capacity 2GB Clock Speed 800Mhz (PC2-6400) Memory Timing CL=6, tRCD=6, tRP=6 Features 240pin, Unbuffer Non-ECC DDR2 SDRAM DIMM Data Bits x64 Internal Module Banks 8 Ranks 2 Data […]

Product name Samsung 8GB DDR3 SDRAM PC3-12800 8GB DIMM (2Tx8, PC3-12800U-11-12-B1, M378B1G73QH0 — CK0) Manufacturer Samsung Electronics Country of manufacture Philippine Build year/week 2014/08 Data Capacity 8GB Clock speed 1600Mhz (PC3-12800) Memory Timing CL=11, tRCD=11, tRP=11 Features 240pin, Unbuffer Non-ECC DDR3 SDRAM DIMM Production process technology 20, 30, 40nm Data bits x64 Internal Module banks 8 Ranks […]

Thuhuu ar producto : EKmemory DDR3 SDRAM 2GB 2Rx8 PC3 — 10600U — 9 — 10 — B0 Fabricante : EKmemory ar ximha̲i ar fabricación : Ar mfeni datos Corea jar Sur : 2GB velocidad ar ora : 1333MHz (PC3 — 10600) Ya 'befi : 240anclar, Desbúfer DDR3 SDRAM DIMM Composición ar chip datos : [EKM324L28BP8 — 13] ✕ 16 chips voltaje VDD : 1.5V Página inicio : HTTP://www.ekmemory.com/bbs/view.php?id=dram&no=91

Thuhuu ar producto: Samsung 4GB DDR3 SDRAM PC3 — 10600 Memory (2Tx8, PC3 — 10600U-09-10-A0, M378B5273DH0 — CH9, M378B5273DH1) Fabricante: Samsung Electronics (SEC) Ar ximha̲i fabricación: Corea ar jar Sur ar je̲ya yá su̲mänä ar nju̲ts'i 2011/31 Ar mfeni datos: 4 GB, velocidad ora: 1333 MHz (PC3 — 10600) Temporización de memoria CL=9, tRCD=9, tRP=9 Características 240pin, Desbúfer DDR3 SDRAM hingi ECC DIMM Bits ar datos x 64 Profundidad / Ar Hmunts'i brocas ya 512M / Módulo interno x 8 […]

Product name Samsung DDR3 SDRAM PC3-10600 2GB Memory (1Rx8 PC3 — 10600U-09-10-A0 M378B5773CH0 — CH9 M378B5263DH1) Manufacturer Samsung Electronics Country of manufacture China Build year/week 2010/38 Data Capacity 2GB Clock speed 1333Mhz (PC3 — 10600) Features 240pin, Unbuffer Non-ECC DDR3 SDRAM DIMM Production process technology 40nm Data bits x64 Internal Module banks 8 Composición chip datos [SEC HCH9 K4B2G0846C] ✕ 8 patatas fritas […]