The Geode NX, with its strong FPU, is particularly suited for embedded devices with graphical performance requirements, such as information kiosks and casino gaming machines, such as video slots.

Product name	AMD Geode NX 1750@14W
Manufacturer	AMD
Country of manufacture	Malaysia
Family/Architecutre	AMD K7 based on Mobile Athlon XP-M
Core name	Thoroughbred
Microarchitecture	AMD K7
Ordering Part Number (OPN)	ANXS1750FXC3M
stepping	BJJF 0535SEPAW
Introduction year/week	2005/35
First release	2004. 5.
Socket	Socket A
Package	462pin OPGA
Data width	32bit
Clock speed	1.4Ghz (1400Mhz)
Front Side Bus	133MHz (266MT/s)
Clock multiplier	10.5
The number of cores	1
The number of threads	1
L1 cache	instructions 64KB + data 64KB
L2 cache	256KB
Production Process	130nm (0.13μm)
VCore	1.25V
Features	3DNow!, MMX and SSE instruction sets
Power management	AMD PowerNow!, ACPI 1.0b and ACPI 2.0
Power consumption	14W (Average)
Thermal Design Power (TDP)	25W
Maximum die temperature	95°C

• Manufacturer : Intel
• Country of manufacture : Malaysia
• Family name : Intel Celeron
• Core name : Mendocino
• Part number : FV524RX466 128 SL3EH
• Clock speed : 200Mhz (66Mhz x 3.0)
• Bus Speed : 66Mhz
• Clock multiplier : 7
• Package type : 370pin PGA
• Socket type : Socket 370
• Data Bandwidth : 32bit
• L1 Cache : 16KB(data, 4-way) + 16KB(instruction, 4-way)
• L2 Cache : 128KB (on-die)
• Memory Addressing Limit : 4GB
• Production process : 0.25µm (250nm), 19million transistors
• Operating Temperature : ~ 70°C
• Features : MMX Technology
• Core voltage : 2V

• Manufacturer : AMD
• Country of manufacture : Malaysia
• Family/Architecutre : AMD Athlon Processor Model 4 Architecutre
• Code name : Thunderbird
• Microarchitecture : AMD K7
• Ordering Part Number (OPN) : A1400AMS3C
• stepping : AYHJA 0135APBW
• Introduction year/week : 2001/35
• First release : 2000. 6. 5. (Thunderbird)
• Socket : Socket A
• Package : 462pin PGA
• Data width : 32bit
• Clock speed : 1.4Ghz (1400Mhz)
• Front Side Bus : 133 MHz (266MT/s, C model)
• Clock multiplier : 10.5
• The number of cores : 1
• The number of threads : 1
• L1 cache : instructions 64KB + data 64KB
• L2 cache: 256KB
• Production Process : 180nm
• Features : MMX, 3DNow
• VCore : 1.75V
• Thermal Design Power (TDP) : max 72.1W / typical 64.7W
• Maximum die temperature : 95°C

• Manufacturer : AMD
• Country of manufacture : Malaysia
• Family/Architecutre : AMD Duron Processor Architecutre
• Code name : Spitfire
• Microarchitecture : AMD K7
• Ordering Part Number (OPN) : D650AUT1B
• Build year/week : 2000/43
• First release : 2000.6.19
• Socket : Socker A (EV6)
• Package type : 462pin PGA
• Data width : 32bit
• Clock rate : 650Mhz
• Front Side Bus (FSB) : 100Mhz (200MT/s)
• Clock multiplier : 6.5
• The number of threads : 1
• L1 cache : instructions 64KB + data 64KB
• L2 cache: 64KB
• Manufacturing Process : 180nm
• Features : MMX, 3DNow!
• Thermal Design Power (TDP) : typical 25.02W / max 27.87W
• Voltage : 1.6V (normal)
• Maximum die temperature : 90°C

• Manufacturer : AMD
• Country of manufacture : Malaysia
• Code name : AMD Athlon II X2 250 Regor
• Microarchitecture : AMD K10
• Part number : ADX2500CK23GQ
• Core stepping : C2
• Introduction year/week : 2010/23
• First release : 2009. 6. (C2 stepping)
• Socket : AM2+ / AM3
• Package : 938-pin organic micro-PGA
• Die size : 117mm²
• Data width : 64bit
• Clock speed : 3Ghz (3000Mhz)
• Clock multiplier : 15
• Bus Speed : 533 MHz Memory controller, One 2000 MHz 16-bit HyperTransport link
• System bus : HyperTransport link 4000MT/s(16GB/s)
• The number of cores : 2
• The number of threads : 2
• L1 cache : 2 ✕ 128KB (instructions 64KB + data 64KB)
• L2 cache: 2 ✕ 1MB
• Manufacturing Process : 45nm SOI, 234 million transistors
• Features : MMX, Extended 3DNow!, SSE, SSE2, SSE3, SSE4a, AMD64, NX bit, AMD-V, Enhanced Virus Protection
• Low power features : Cool’n’Quiet, CoolCore Technology, Dual Dynamic Power Management, Core C1 and C1E states, Package S0, S1, S3, S4 and S5 states
• On-chip peripherals : Integrated 144-bit DDR2/DDR3 Memory Controller, HyperTransport 3 technology
• supported memory : DDR2-1066 and DDR3-1066
• Thermal Design Power (TDP) : 65W
• Voltage : 0.85~1.425V
• Maximum operating temperature : 55~ 74°C

Inside and outside clock speed of 486DX is same. 486DX2 contained double clocking technology increasing inside speed to two times of outside speed. DX3 was a standard that made use of 2.5× multiplier, but it was not released as common product. In IntelDX4, 3.0× multiplier operates.

IntelDX4 supports 3.3/3.45V regular voltage, 2×/3× multiples and 25/33/50Mhz FSB speeds.

‘SK051′ receives 33Mhz FSB speed and 3.45V voltage. It operates at 100Mhz clock speed(3× FSB speed). It cannot support 2x multiple. ‘&E’ means that it is write-through cache version. (If ‘&EW’ is written, the CPU contains write-back cache.)

intelDX4 exactly fits 169pins Socket 1. But It can put 238pins Socket 2 and 237pins Socket 3. Socket1/2 supports 5V. To safely use IntelDX4 on Socket1/2, the motherboard must be able to modulate CPU Voltage to 3.3V.

Previous CPUs generated low heat, so they could use without heatsink. But DX4 was too hot to use without heatsink because of DX4 speed attain to 75~120Mhz. Attaching heatsink and fan on CPU chip is general after DX4.

• Manufacturer : Intel
• Code Name : IntelDX4 (Intel 80486DX4)
• Intruduced Time : 1994. 3. 7.
• Part Number : A80486DX4-100 SK051
• Country of manufacture : Malaysia
• Core Speed : 100Mhz (33Mhz x 3.0)
• Bus Speed : 33Mhz
• Process : 0.6㎛
• Features : 169pin, Socket1/2/3
• Voltage : 3.45V (3.3~3.6V)
• L1 cache : 16KB

• Manufacturer : Intel
• Country of Manufacture : Malaysia
• Code Name : Pentium MMX 200 (P55C)
• Part Number : FV80503200
• Introduction Date : 1997. 1. 8.
• Clock Speed : 200Mhz (66Mhz x 3.0)
• Bus Speed : 66Mhz
• Data Bandwidth : 32bit (64bit data bus)
• L1 Cache : 16KB(data, 4-way) + 16KB(instruction, 4-way)
• Memory Addressing Limit : 4GB
• Process : 0.35µm
• Die size : 141mm²
• Operating Temperature : 0 ~ 70°C
• Features : Socket 7, 296pin, MMX Technology
• Voltage : 2.8V(Core), 3.3V(input/output)