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		<title>Samsung 4GB PC3-10600 DDR3 SDRAM SO-DIMM</title>
		<link>https://www.devicelog.com/jw/memory/dram/ddr3-sdram/samsung-sodimm-ddr3-pc3-10600-4gb-ram/</link>
					<comments>https://www.devicelog.com/jw/memory/dram/ddr3-sdram/samsung-sodimm-ddr3-pc3-10600-4gb-ram/#comments</comments>
		
		<dc:creator><![CDATA[Piranti Login.com]]></dc:creator>
		<pubDate>Mon, 02 Mar 2015 13:25:48 +0000</pubDate>
				<category><![CDATA[DDR3 SDRAM]]></category>
		<category><![CDATA[4GB]]></category>
		<category><![CDATA[China]]></category>
		<category><![CDATA[DDR3]]></category>
		<category><![CDATA[DRAM]]></category>
		<category><![CDATA[Korea]]></category>
		<category><![CDATA[PC3-10600]]></category>
		<category><![CDATA[RAM]]></category>
		<category><![CDATA[Samsung]]></category>
		<category><![CDATA[SO-DIMM]]></category>
		<guid isPermaLink="false">https://www.devicelog.com/?p=791-jw</guid>

					<description><![CDATA[Samsung Electronics ngeculake modul DDR3 SDRAM nggunakake teknologi proses 30nm ing wulan Juli 2010. Modul RAM iki digawe dening teknologi proses 40nm. Jeneng produk Samsung DDR3 SDRAM PC3-10600 4GB SO-DIMM (2Rx8, PC3-10600S-09-10-F2, M471B5273CH0-CH9) Produsen Samsung Electronics (SEK) Negara pabrik China Mbangun taun / minggu 2011/13 Kapasitas Data 4GB Kacepetan jam 1333Mhz (PC3-10600) Wektu Memori [&#8230;]]]></description>
										<content:encoded><![CDATA[<p>Samsung Electronics ngeculake modul DDR3 SDRAM nggunakake teknologi proses 30nm ing wulan Juli 2010. This RAM module was made by the 40nm process technology.</p>
<p><a href="https://www.devicelog.com/wp-content/uploads/2015/03/Samsung-SODIMM-DDR3-PC3-10600-4GB-RAM-frontside.jpg" data-rel="lightbox-gallery-TpujI3px" data-rl_title="Samsung SODIMM DDR3 PC3-10600 4GB" data-rl_caption="" title="Samsung SODIMM DDR3 PC3-10600 4GB"><img fetchpriority="high" decoding="async" class="aligncenter wp-image-792 size-medium" src="https://www.devicelog.com/wp-content/uploads/2015/03/Samsung-SODIMM-DDR3-PC3-10600-4GB-RAM-frontside-500x240.jpg" alt="Samsung SODIMM DDR3 PC3-10600 4GB frontside" width="500" height="240" srcset="https://www.devicelog.com/wp-content/uploads/2015/03/Samsung-SODIMM-DDR3-PC3-10600-4GB-RAM-frontside-500x240.jpg 500w, https://www.devicelog.com/wp-content/uploads/2015/03/Samsung-SODIMM-DDR3-PC3-10600-4GB-RAM-frontside-200x96.jpg 200w, https://www.devicelog.com/wp-content/uploads/2015/03/Samsung-SODIMM-DDR3-PC3-10600-4GB-RAM-frontside.jpg 749w" sizes="(max-width: 500px) 100vw, 500px" /></a> <a href="https://www.devicelog.com/wp-content/uploads/2015/03/Samsung-SODIMM-DDR3-PC3-10600-4GB-RAM-rearside.jpg" data-rel="lightbox-gallery-TpujI3px" data-rl_title="Samsung SODIMM DDR3 PC3-10600 4GB" data-rl_caption="" title="Samsung SODIMM DDR3 PC3-10600 4GB"><img decoding="async" class="aligncenter wp-image-793 size-medium" src="https://www.devicelog.com/wp-content/uploads/2015/03/Samsung-SODIMM-DDR3-PC3-10600-4GB-RAM-rearside-500x239.jpg" alt="Samsung SODIMM DDR3 PC3-10600 4GB rearside" width="500" height="239" srcset="https://www.devicelog.com/wp-content/uploads/2015/03/Samsung-SODIMM-DDR3-PC3-10600-4GB-RAM-rearside-500x239.jpg 500w, https://www.devicelog.com/wp-content/uploads/2015/03/Samsung-SODIMM-DDR3-PC3-10600-4GB-RAM-rearside-200x96.jpg 200w, https://www.devicelog.com/wp-content/uploads/2015/03/Samsung-SODIMM-DDR3-PC3-10600-4GB-RAM-rearside.jpg 749w" sizes="(max-width: 500px) 100vw, 500px" /></a></p>
<table>
<tbody>
<tr>
<th>Jeneng produk</th>
<td>Samsung DDR3 SDRAM PC3-10600 4GB SO-DIMM<br />
(2Rx8, PC3-10600S-09-10-F2, M471B5273CH0-CH9)</td>
</tr>
<tr>
<th>Produsen</th>
<td>Samsung Electronics (SEK)</td>
</tr>
<tr>
<th>Negara pabrik</th>
<td>China</td>
</tr>
<tr>
<th>Mbangun taun / minggu</th>
<td>2011/13</td>
</tr>
<tr>
<th>Kapasitas Data</th>
<td>4GB</td>
</tr>
<tr>
<th>Kacepetan jam</th>
<td>1333Mhz (PC3-10600)</td>
</tr>
<tr>
<th>Wektu Memori</th>
<td>CL = 9, tRCD = 9, tRP = 9</td>
</tr>
<tr>
<th>Fitur</th>
<td>204jiwit, SODIMM, Unbuffer Non-ECC DDR3 SDRAM</td>
</tr>
<tr>
<th>Teknologi proses produksi</th>
<td>40nm</td>
</tr>
<tr>
<th>Bit data</th>
<td>x64</td>
</tr>
<tr>
<th>Bank Modul Internal</th>
<td>8</td>
</tr>
<tr>
<th>Pangkat</th>
<td>2</td>
</tr>
<tr>
<th>Komposisi chip data</th>
<td>256M x 8 * 16 pcs</td>
</tr>
<tr>
<th>Revisi komponen</th>
<td>2Gb, C-ing</td>
</tr>
<tr>
<th>Paket</th>
<td>78 bal FBGA</td>
</tr>
<tr>
<th>Dhuwur</th>
<td>30mm</td>
</tr>
<tr>
<th>Tegangan VDD</th>
<td>1.5V</td>
</tr>
<tr>
<th>Range suhu Operating Case</th>
<td>0° C ~ 85 ° C</td>
</tr>
</tbody>
</table>
]]></content:encoded>
					
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			<slash:comments>3</slash:comments>
		
		
			</item>
		<item>
		<title>Samsung 4GB DDR3 SDRAM DIMM PC3-10600 1333Mhz (2Rx8, Korea)</title>
		<link>https://www.devicelog.com/jw/memory/dram/ddr3-sdram/samsung-ddr3-sdram-4gb-pc3-10600-1333mhz-2rx8-korea/</link>
					<comments>https://www.devicelog.com/jw/memory/dram/ddr3-sdram/samsung-ddr3-sdram-4gb-pc3-10600-1333mhz-2rx8-korea/#respond</comments>
		
		<dc:creator><![CDATA[Piranti Login.com]]></dc:creator>
		<pubDate>Thu, 10 Jan 2013 02:20:09 +0000</pubDate>
				<category><![CDATA[DDR3 SDRAM]]></category>
		<category><![CDATA[1.5v]]></category>
		<category><![CDATA[240jiwit]]></category>
		<category><![CDATA[4GB]]></category>
		<category><![CDATA[DDR]]></category>
		<category><![CDATA[DDR3]]></category>
		<category><![CDATA[DIMM]]></category>
		<category><![CDATA[HCH9]]></category>
		<category><![CDATA[K4B2G0846D]]></category>
		<category><![CDATA[Korea]]></category>
		<category><![CDATA[memori]]></category>
		<category><![CDATA[Non-ECC]]></category>
		<category><![CDATA[Samsung]]></category>
		<category><![CDATA[Ora diganggu]]></category>
		<guid isPermaLink="false">https://www.devicelog.com/?p=602-jw</guid>

					<description><![CDATA[Jeneng produk Samsung 4GB DDR3 SDRAM PC3-10600 Memori (2Rx8, PC3-10600U-09-10-A0, M378B5273DH0-CH9, M378B5273DH1) Produsen Samsung Electronics (SEK) Negara pabrik Korea Selatan Mbangun taun / minggu 2011/31 Kapasitas Data 4GB Kacepetan jam 1333Mhz (PC3-10600) Wektu Memori CL=9, tRCD = 9, tRP=9 Fitur 240pin, Unbuffer Non-ECC DDR3 SDRAM DIMM Data bit x64 Ambane / Organisasi bit 512M / x8 Modul Internal [&#8230;]]]></description>
										<content:encoded><![CDATA[<p style="text-align: center;"><a href="https://www.devicelog.com/wp-content/uploads/2013/01/Samsung_DDR3_4GB_2Rx8_PC3-10600U-09-11-B1_M378B5273DH0-CH9_1131.jpg" data-rel="lightbox-gallery-6P6mXXnD" data-rl_title="Samsung DDR3 4GB 2Rx8 PC3-10600U-09-11-B1 M378B5273DH0-CH9 1131" data-rl_caption=""><img decoding="async" class="aligncenter size-medium wp-image-608" title="Samsung DDR3 4GB 2Rx8 PC3-10600U-09-11-B1 M378B5273DH0-CH9 1131" src="https://www.devicelog.com/wp-content/uploads/2013/01/Samsung_DDR3_4GB_2Rx8_PC3-10600U-09-11-B1_M378B5273DH0-CH9_1131-500x278.jpg" alt="Samsung DDR3 SDRAM 4GB Memory  DIMM (2Rx8 PC3-10600U-09-11-B1 M378B5273DH0-CH9 1131)" width="500" height="278" srcset="https://www.devicelog.com/wp-content/uploads/2013/01/Samsung_DDR3_4GB_2Rx8_PC3-10600U-09-11-B1_M378B5273DH0-CH9_1131-500x278.jpg 500w, https://www.devicelog.com/wp-content/uploads/2013/01/Samsung_DDR3_4GB_2Rx8_PC3-10600U-09-11-B1_M378B5273DH0-CH9_1131-200x111.jpg 200w, https://www.devicelog.com/wp-content/uploads/2013/01/Samsung_DDR3_4GB_2Rx8_PC3-10600U-09-11-B1_M378B5273DH0-CH9_1131.jpg 1200w" sizes="(max-width: 500px) 100vw, 500px" /></a></p>
<table>
<tbody>
<tr>
<th>Jeneng produk</th>
<td>Samsung 4GB DDR3 SDRAM PC3-10600 Memori<br />
(2Rx8, PC3-10600U-09-10-A0, M378B5273DH0-CH9, M378B5273DH1)</td>
</tr>
<tr>
<th>Produsen</th>
<td>Samsung Electronics (SEK)</td>
</tr>
<tr>
<th>Negara pabrik</th>
<td>Korea Kidul</td>
</tr>
<tr>
<th>Mbangun taun / minggu</th>
<td>2011/31</td>
</tr>
<tr>
<th>Kapasitas Data</th>
<td>4GB</td>
</tr>
<tr>
<th>Kacepetan jam</th>
<td>1333Mhz (PC3-10600)</td>
</tr>
<tr>
<th>Wektu Memori</th>
<td>CL = 9, tRCD = 9, tRP = 9</td>
</tr>
<tr>
<th>Fitur</th>
<td>240jiwit, Unbuffer Non-ECC DDR3 SDRAM DIMM</td>
</tr>
<tr>
<th>Bit data</th>
<td>x64</td>
</tr>
<tr>
<th>ambane / Organisasi bit</th>
<td>512M / x8</td>
</tr>
<tr>
<th>Bank Modul Internal</th>
<td>8</td>
</tr>
<tr>
<th>Pangkat</th>
<td>2</td>
</tr>
<tr>
<th>Komposisi chip data</th>
<td>[SEC HCH9 K4B2G0846D] ✕ 16 kripik<br />
(256Mbit ✕ 8 ✕ 16 pcs)</td>
</tr>
<tr>
<th>Revisi komponen</th>
<td>4generasi th</td>
</tr>
<tr>
<th>Paket</th>
<td>FBGA (Bebas timbal &amp; Bebas halogen)</td>
</tr>
<tr>
<th>Dhuwur</th>
<td>30mm</td>
</tr>
<tr>
<th>Tegangan VDD</th>
<td>1.5V</td>
</tr>
<tr>
<th>Range suhu Operating Case</th>
<td>0° C ~ 85 ° C</td>
</tr>
</tbody>
</table>
]]></content:encoded>
					
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			<slash:comments>0</slash:comments>
		
		
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